- Locations: California, New Hampshire, Virginia, Massachusetts, Maryland
- Related Keywords: Chip, Management, Thermal, Thermal Management
- Principle Electrical Engineer
- BAE SYSTEMS Inf&Elec Sys Intg (Merrimack, NH)
- ...sections, minimizing signal loss and interface mismatch, and managing thermal dissipation. Qualified candidates will work with in-house and...experience in RFIC/mixed-signal module design and development Experience with flip- chip , System on Chip (SoC), high density...
- Senior Laser & Optical Scientist
- SAIC (Chantilly, VA)
- ...addition to providing guidance on spaceborne laser electrical and thermal management . EXPERIENCE Required: Approximately 15 years...engineering field. SKILLS Required: 1) Proficient knowledge of hybrid chip assembly, bonding, CMOS/CCD, and manufacturing and assembly. 2)...
- Senior Flip Chip Engineer
- Premier Personnel Services (Clintondale, NY)
- ...in our prototype development lab to develop next generation flip chip packaging. This individual should have a thorough understanding of the...in relation to electronics package reliability. . Knowledge of advanced thermal management materials and strategies. . Use of decision...
- Thermal /Mechanical IC Engineer
- Qualcomm (San Diego, CA)
- ...SoC/SiP IC products, including new technologies such as Through-Silicon-Via 3D Chip integration, PoP, EDS, etc. Successful candidate will be able to...will include: . Definition of, and Gaining Acceptance for, a Thermal Management Strategy . Definition of, and Gaining Acceptance...
- Principle Electrical Engineer
- BAE Systems (Merrimack, NH)
- ...sections, minimizing signal loss and interface mismatch, and managing thermal dissipation. Qualified candidates will work with in-house and...RFIC/mixed-signal module design and development i? 1/2 Experience with flip- chip , System on Chip (SoC), high density...
- Senior Module Engineer
- National Semiconductor (Santa Clara, CA)
- ...Product Introduction documentation and requirements. * Experience in Multi Chip Modules (MCM), Multi Chip Packages (MCP),...knowledge of systems, package constructions, interconnect schemes, material technologies, thermal management , process and manufacturing techniques, and...
- Elect Design & Analysis- Digital Hardware Engineer 1/2- DRT
- The Boeing Company (Germantown, MD)
- ...Integrated Defense Sys Division Networks & Space Systems Program Intelligence&Security Systems Occupation Title Electronic & Electrical Engr Skills Management Title Digital and Analog Circuits an Job Classification 6B1DP1 Note: The level of the classification for a specific...
- Elect Design & Analysis- FPGA Engineer 2/3- DRT
- The Boeing Company (Germantown, MD)
- ...Integrated Defense Sys Division Networks & Space Systems Program Intelligence&Security Systems Occupation Title Electronic & Electrical Engr Skills Management Title Digital and Analog Circuits an Job Classification 6B1DP2 Note: The level of the classification for a specific...
- 3D Technology Integration Engineer
- Qualcomm (San Diego, CA)
- ...will be responsible for the 3D chip partition, 3D chip architecture exploration- clock, power, memory and thermal . The candidate...3D Die to Die interface design. 6) 3D power distribution and thermal aware management Skills/Experience The ideal candidate has the following...
- IC Package Design Engineer
- Qualcomm (San Diego, CA)
- ...Package design technology and configurations including wire bond, flip chip , SiP, PoP, PiP, Stacked Die, Module and Discrete -...levels - Package level netlist capture and mechanical/electrical constraint management - Package level thermal performance and enhancement...
- Packaging Engineering Professional
- IBM (Hopewell Junction, NY)
- ...of interconnection and assembly processes for state-of- the-art, Flip Chip , Plastic Ball Grid Array (FC PBGA) organic and...assembly parameters such as soldering fluxes, cleaning methods, underfills, thermal interface materials and lid adhesives. Working with advanced...
- Technology Development Manager II - Advanced Integration Technologies
- BAE Systems (NH)
- ...requires knowledge of: chip , wafer and module level integration technologies, 3D integration concepts, bonding techniques, mechanical packaging, thermal management , effects of RF and electrical prosperities within high density integrated modules, an understanding of MEMs...
- Test Engr Sr
- Tyco Electronics (Winston Salem, NC)
- ...and in working closely with the teams of design, manufacturing, product management , sales and customers. The job is located in Reno, NV.In...as well as system testing with selected PHY and power controller chip reference design teams. In this capacity, this position requires close...
- 3D Technology Integration Engineer
- Qualcomm (San Diego, CA)
- ...will be responsible for the 3D chip partition, 3D chip architecture exploration- clock, power, memory and thermal . The candidate...3D Die to Die interface design. 6) 3D power distribution and thermal aware management Skills/Experience The ideal candidate has the following...