• Silicon Packaging Engineer

    Meta (Menlo Park, CA)
    **Summary:** Meta is looking for an experienced Silicon Packaging Engineer for its Ecosystem and Technical Operation team. The ideal candidate will be able ... are optimal for our AI/ML products and system level performance. **Required Skills:** Silicon Packaging Engineer Responsibilities: 1. Development of advanced… more
    Meta (06/06/24)
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  • IC Packaging Engineer

    SpaceX (Bastrop, TX)
    IC Packaging Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring ... possible, with the ultimate goal of enabling human life on Mars. IC PACKAGING ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in… more
    SpaceX (04/04/24)
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  • Principal Quality Engineer , Silicon

    SpaceX (Bastrop, TX)
    Principal Quality Engineer , Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where humanity is out exploring ... with the ultimate goal of enabling human life on Mars. PRINCIPAL QUALITY ENGINEER , SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in building… more
    SpaceX (04/09/24)
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  • Component Quality Engineer , Silicon

    Meta (Fremont, CA)
    …AI/ML, Compute, Storage and Networking products. **Required Skills:** Component Quality Engineer , Silicon Products Responsibilities: 1. Responsible for managing ... **Summary:** Meta is seeking a Component Quality Engineer responsible for working with Meta's suppliers and manufacturing partners to develop and implement world… more
    Meta (05/01/24)
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  • ATE Test Engineer , Silicon

    Google (Mountain View, CA)
    …structural tests such as Scan/ATPG, JTAG, and memory BIST. + Familiarity with advanced packaging such as 2.5d, InFo. + Familiarity with process technology and how it ... software and networking technologies that power all of Google's services. As a Hardware Engineer , you design and build the systems that are the heart of the world's… more
    Google (06/08/24)
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  • Platform Hardware Development Engineer

    Google (San Diego, CA)
    …+ 8 years of experience in design and bring-up of hardware for post silicon validation of SoCs. + Experience driving HDI and multi-layer PCBs from concept and ... that power all of Google's services. As a Hardware Engineer , you design and build the systems that are...internal and external teams. You will work with Product, Packaging , Signal integrity and Power Integrity (SIPI), Software and… more
    Google (05/21/24)
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  • Post Silicon Test Engineer - Digital

    Qualcomm (San Diego, CA)
    …bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging , test systems, FPGA, and/or DSP systems. * Integrates ... features and functionality into hardware designs in line with proposals or roadmaps. * Conducts simulations and analyses of designs as well as implements designs with the best power, performance, and area. * Collaborates with teams (eg, design, verification,… more
    Qualcomm (04/25/24)
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  • Laser Module Packaging Engineer

    Lightmatter (Mountain View, CA)
    Laser Module Packaging Engineer Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that ... You will be part of a cross-functional team consisting of silicon photonics, analog, packaging , and system engineers to drive various Laser Module development… more
    Lightmatter (04/13/24)
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  • Sr Specialist, Advanced Electronics…

    L3Harris (Palm Bay, FL)
    Job Title: Sr Specialist, Advanced Electronics Packaging Development Engineer Job Code: 9331 Job Location: Palm Bay, FL Job Description: The L3Harris ... Microelectronics organization is growing our advanced packaging research and development efforts and capabilities. This role...and associated thermal, mechanical, and assembly issues + Through Silicon Vias (TSVs) + MEMS and wafer bonding +… more
    L3Harris (04/05/24)
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  • Member of Technical Staff - Advanced…

    Micron Technology, Inc. (Boise, ID)
    …the world to learn, communicate and advance faster than ever. Micron's Advanced Packaging Technology Development group is seeking a **Member of Technical Staff** or ... **Principal Process Development Engineer ** to join a growing team of Technology Development...time to join the semiconductor industry and advances in packaging technology will revolutionize the applications in which semiconductors… more
    Micron Technology, Inc. (04/24/24)
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  • RF Modeling and Simulation Engineer

    NY CREATES (Albany, NY)
    Engineer NY CREATES is seeking applicants for RF Modeling and Simulation Engineer for Silicon Photonics This position is part of the Electronic Photonic ... 1.) Process Design Kit (PDK) Components in AIM Photonics Silicon Photonics technologies. 2.) Interconnects in Assembly, Packaging... Packaging and RF offerings for AIM Photonics Packaging technologies. In addition, the engineer is… more
    NY CREATES (06/05/24)
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  • Senior Mixed Signal Design Engineer

    Microsoft Corporation (Raleigh, NC)
    Microsoft Silicon , Cloud Hardware, and Infrastructure Engineering (SCHIE) is driving Microsoft's expanding Cloud Infrastructure and responsible for powering ... To achieve this goal, the Semi-custom and Central IP Silicon (SCIPS) team is instrumental in architecting, designing, and...We are looking for a **Senior** **Mixed Signal Design Engineer ** to join the team. Microsoft's mission is to… more
    Microsoft Corporation (05/25/24)
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  • Lead Manufacturing Engineer

    Danfoss (Utica, NY)
    Lead Manufacturing Engineer Requisition ID: 36876 Job Location(s): Utica, NY, US **Job Description** Support the integration of production equipment into ... fixing, improvement, refactoring and miDanfoss is looking for Lead Manufacturing Engineer with technical background who is passionate towards continuous improvement… more
    Danfoss (03/14/24)
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  • Photonics Integrated Circuit (PIC) Senior…

    RTX Corporation (San Diego, CA)
    …+ Contribute to selection of COTS/custom photonic (discrete and silicon photonics) components, RF electronics, mixed-signal electronics, and embedded/digital signal ... mentor, and train employees within the integrated photonics, RF, electro-optic, packaging , and signal processing technical domains + Responsible for providing… more
    RTX Corporation (06/07/24)
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  • Principal/Sr Principal EM Simulation…

    Northrop Grumman (Linthicum, MD)
    …Design, Advanced Technology Laboratory (ATL) Foundry, Electromagnetic Simulations, and RF Packaging teams. Selected candidates will build upon their previous ... silicon wafer fabrication, materials science, and EM single/multi-port circuit...MD area facilities.** Basic Qualifications - Principal EM Simulation Engineer : + BS in electrical engineering, or a related… more
    Northrop Grumman (06/04/24)
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  • HBM Design Engineer - Fellow

    Micron Technology, Inc. (Atlanta, GA)
    …world to learn, communicate and advance faster than ever. As an HBM Design Engineer , you will be responsible for the design & development of next-generation HBM DRAM ... + Drive novel, high performance designs from concept to tape-out and post- silicon support. + Lead a team of technical designers for specification definition,… more
    Micron Technology, Inc. (04/02/24)
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  • Hardware Developer - Process Integration…

    IBM (Albany, NY)
    …Role and Responsibilities IBM Research at Albany, NY is seeking a process integration engineer who will push boundaries in the integration of advanced logic and next ... generation semiconductor packaging technologies. In this role, you will be responsible...that span the back end of the line (BEOL) silicon semiconductor processing, wafer finishing, and grindside processing. You… more
    IBM (06/01/24)
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  • Senior Failure Analysis Engineer

    NVIDIA (Santa Clara, CA)
    Join the forefront of technological innovation at NVIDIA Silicon Failure Analysis Lab. We're seeking an experienced Failure Analysis Engineer to join our dynamic ... of semiconductor ICs, boards, and systems, featuring advanced semiconductor process and packaging technologies. What you'll be doing: + Perform and coordinate both… more
    NVIDIA (06/06/24)
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  • Memory Interface Development Engineer

    Micron Technology, Inc. (Boise, ID)
    …while rapidly growing your abilities **In our hybrid role,** as a PE Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team, you will be tasked with ... innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product Engineers are the key interface between Research and… more
    Micron Technology, Inc. (03/21/24)
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  • Failure Analysis Engineer

    Danfoss (Utica, NY)
    Failure Analysis Engineer Requisition ID: 39059 Job Location(s): Utica, NY, US **Job Description** As Failure Analysis Engineer you make an important ... is a family-owned business, merged by SEMIKRON and Danfoss Silicon Power in 2022. We employ more than 3,500...than 90 years of combined expertise in power module packaging , innovation and customer applications - making us the… more
    Danfoss (06/08/24)
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