- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. As a Process Integration engineer in the 3D DRAM organization, you will be part of a team ... include integration and circuit issues specific to 3D DRAM technology. In addition to a... integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components… more
- Micron Technology, Inc. (Boise, ID)
- …or Senior Member of Technical Staff (SMTS), you will be part of a groundbreaking 3D DRAM research and development Wet Process team! We evaluate new hardware ... to develop processes that meet device requirements for future 3D DRAM technology nodes; transfer processes to...engineer in aR&D environment preferred + Experience in DRAM or Memory is preferred. As a world leader… more
- Micron Technology, Inc. (Folsom, CA)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... advanced CMOS technology qualification and mass production ramp-up. + Collaborating with integration , module & 3D packaging teams (internal and external) to… more
- Micron Technology, Inc. (Atlanta, GA)
- …circuit design, memory subsystem operation, high-performance computing architectures a,nd 2.5D & 3D package integration to understand and analyze bottlenecks and ... and advance faster than ever. As an HBM Design Engineer , you will be responsible for the design &...responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly… more
- Micron Technology, Inc. (Boise, ID)
- …Memory DRAM solutions! Additionally, implementation of innovative 2.5D and 3D solutions, including HBM, from an electrical and packaging standpoint. Product ... abilities **In our hybrid role,** as a PE Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team,...company's charter to be the most cost-effective producer of DRAM memory. In HBM DEG (High Bandwidth Memory, … more
- Micron Technology, Inc. (Allen, TX)
- …circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and ... of experience and education. In HBM DEG (High Bandwidth Memory - DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend… more
- Micron Technology, Inc. (Boise, ID)
- …limited to:** + Developing optical overlay/registration metrology applications on next generation 3D NAND/ DRAM processes within Fab 4 and qualification for ... of metrology systems. + Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and… more