- Renesas (Godair, MO)
- SOC Package Substrate and Application Board Transmission Line Design Engineer Job Description Responsible for SoC package substrate and/or ... PCB, circuit and artwork + Define the requirement of SoC package substrate and/or Reference Application PCB + Specify the outline of the circuit/artwork… more
- Micron Technology, Inc. (Boise, ID)
- …and other chiplet/SiP architectures. + Experience with wafer bumping, wafer bonding, package assembly, substrate technology, BOM selection, testing and product ... of Technical Staff or Distinguished Member of Technical Staff in Advanced Packaging Technology Development, you will be a technical leader in Micron's Advanced… more
- Micron Technology, Inc. (Austin, TX)
- …WoW, InFO, and other chiplet/SiP architectures. + Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product ... to learn, communicate and advance faster than ever. As an Advanced Packaging Distinguished Member of Technical Staff/Fellow in the Compute and Networking Business… more
- Siemens Digital Industries Software (Fremont, CA)
- …3D IC designs. These workflows include package floor planning, package /chiplet level functional/ IO planning, interposer/ substrate planning, layout, ... performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering...Working knowledge (3-5 years of experience preferred) of Advanced Packaging IC EDA tools and design methods including: o… more